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Manus to return as independent company as separation from Meta proceeds_我的网站

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Manus, an AI agent released by start-up Monica Photo: VCG
    Manus, an AI agent released by start-up Monica Photo: VCG
Manus, an AI agent released by Singapore-based tech start-up Monica, said in a note to users on Tuesday that it will soon return to operating as an independent company. 
According to the company's note, "this is part of our separation from Meta; we must take this step to comply with regulatory requirements in specific parts of the world."
As part of Manus transition back to independent operations and to comply with regulatory requirements in specific jurisdictions, data generated by certain users on or after December 29, 2025, will be deleted from 8:00 am on August 23 through August 24, 2026 (SGT), according to the note.  
Affected users will be able to back up their data from now until 7:59 am on August 23, 2026 (SGT) and restore it starting from 8:00 am on August 25, 2026 (SGT), according to the company.
Regarding why the data deletion only affects data generated since December 29, 2025, Manus said in the note that Meta acquired Manus on that date. Data generated by some users on or after the acquisition needs to be deleted to comply with regulatory requirements in certain jurisdictions.
In March 2025, the startup Butterfly Effect launched Manus. As the world's first general AI agent, Manus became an overnight sensation with a demo video, and access codes were, at one point, resold for tens of thousands of yuan. As a result, Manus was briefly seen by the industry as "the second DeepSeek." Just a few months later, however, Manus moved its headquarters to Singapore, significantly downsized its domestic team, retained only core technical staff, and ceased its services and operations in China.
In December last year, Meta announced the acquisition of Manus for approximately $2 billion, making it the third-largest acquisition in Meta's history.
In April, China's Office of the Working Mechanism for Security Review of Foreign Investment under the National Development and Reform Commission (NDRC) announced its decision to prohibit, in accordance with laws and regulations, the foreign acquisition of the Manus project and required the parties involved to revoke the transaction, according to the official website of the NDRC.
This decision reflects China's continued efforts to improve its foreign investment review system and regulate cross-border mergers and acquisitions in accordance with laws and regulations, Ma Jihua, a veteran industry analyst, told the Global Times in a previous interview.
Addressing a question that the office of the foreign investment security review working mechanism has formally issued a decision to prohibit foreign investment in the Manus acquisition project and has ordered the parties involved to revoke the acquisition deal, and that two Manus executives have reportedly been barred from leaving China, Lin Jian, a spokesperson for the Chinese Foreign Ministry, told a press briefing on April 28 that " As a matter of principle, I would like to stress that the Chinese government conducts reviews of foreign investment and makes relevant decisions in accordance with laws and regulations."
Global Times
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image财联社8月24日讯(编辑 马兰)人工智能数据中心使用的高带宽内存(HBM)技术正在出现重大转向。SK海力士美国公司副总裁Lee Jae-sik最新表示,未来行业不仅需要关注HBM本身,还需要关注封装技术如何影响HBM。Lee在当地时间23日出席了美国斯坦福大学举行的半导体会议Hot Chips 2026,并发表了题为“HBM的高科技封装”演讲。他表示,在人工智能半导体时代,为了确保竞争力,不仅HBM本身的性能需要优化,GPU、封装和代工工艺也必须进行优化。目前,SK海力士的HBM采用三维堆叠式设计,通过硅通孔将多个核心芯片连接到一个基底芯片上。HBM目前最高可达16层堆叠。封装技术则采用了MR+MUF(回流焊+注塑底部填充)。

B | 相比于TC+NCF(热压+非导电薄膜),MR+MUF生产效率更高,热阻更低,但更容易发生芯片翘曲,并且存在间隙填充方面的不足。但SK海力士结合了翘曲控制和精细间距集成及窄间隙填充新技术,成功提高了现有HBM的性能。

C | SK海力士还在开发混合键合封装技术,以实现超越16层堆叠的20层或更多层的目标。该技术可在相同高度下将核心芯片厚度增加高达24%,并通过消除现有微凸点并直接连接芯片,将凸点间距缩小至18微米以下。此外,该技术有望通过更高效的散热来减少发热问题。

携手优化的时代与现有存储器不同,HBM在人工智能半导体中首先被组装到中介层上。Lee指出,过去存储器是在系统组装的最后阶段安装的,但在人工智能时代截然不同,这要求HBM的可靠性更加重要。他补充称,HBM必须承受后续工艺中产生的热量和机械应力,因此与客户进行联合开发至关重要。这也意味着,内存厂商、GPU设计商、代工厂和封装厂商必须从一开始就进行协同设计。SK海力士还在会上发布了一项用于冷却HBM内部特定区域“热点”的技术。Lee表示,HBM的输入/输出速度越快,热量就越集中在某些区域。

D | 正在开发的iHBM技术通过添加耐高温导热材料,只对热量集中的区域进行集中冷却,而非对整个HBM进行冷却。他还指出,HBM的带宽和容量未来将继续增长,但发热、功耗和封装将成为更大的挑战,这要求客户、代工厂和封装公司必须携手优化。

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Published on:01:47:03


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